Furukawa Electric Begins Mass Producing Stealth Dicing Tape

03-Aug-2017 Intellasia | BusinessWire | 8:00 AM Print This Post

New Semiconductor Tape Significantly Improves
Semiconductor Quality

TOKYO–(BUSINESS WIRE)–Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand
separation dicing tape, a type of tape for use with semiconductors.
Expand separation dicing tape delivers high-grade separation of IC chips
from wafers after the stealth dicing process.


Background

Semiconductors have truly become a familiar and necessary part of daily
life. Semiconductors will need to offer increased functionality in order
to process and utilize the huge amounts of big data that will be
generated with the arrival of the age of IoT. These components are
expected to continue to grow thinner and denser. Higher grade cutting
and separation (dicing) of IC chips from wafers will be required to meet
these needs, and a variety of manufacturing methods are already being
proposed.

In conventional manufacturing processes, mechanical methods are used to
dice wafers into several IC chips. However, in order to obtain chips
with better yields and improved quality, methods in which it is made
easier for wafers to be broken into chips (such as using a laser to form
a modifying layer inside the wafer) and in which wafers are separated
and cut by expanding semiconductor tape applied to wafers in a radial
direction are gaining recent attention.

Content

Furukawa Electric has begun mass producing expand separation dicing
tape, a type of tape for use with semiconductors. In addition to not
breaking even under high speed/high pull expansion conditions subject to
heavy loads, expand separation dicing tape offers uniform expansion
without any internal stretching (“necking”), allowing for wafers to be
separated in excellent condition regardless of chip size. The product
also offers excellent expansion and preservation characteristics between
chips, helping to significantly reduce process machining time. Die
attach film (DAF), a crucial component in mounting semiconductor chips,
can also be separated and cut along with the chips, resulting in
reliable pickup functionality.

Product Features & Data/Specifications

  • In addition to separating wafers via expansion using semiconductor
    tape, the product offers superior DAF separation and
    expansion/preservation characteristics between chips, allowing for
    simple pickup.
  • Comes in a roll shape with circular DAF attached to dicing tape.
    Standard length of 100 m/roll; tape thickness varies by type (100 to
    200 μm).

Contacts

Furukawa Electric Co., Ltd.
Toru Sano, +81-463-24-8335
[email protected]

 


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