Hua Hong Semiconductor Second Generation 0.18um 5V/40V BCD Process Platform Successfully Mass Produced

11-Oct-2018 Intellasia | 10-OCT-2018 ACN Newswire | Hua Hong Semiconductor | 6:00 AM Print This Post

HONG KONG, Oct 10, 2018 – (ACN Newswire) – Hua Hong Semiconductor Ltd (1347.HK), a global, leading specialty pure-play foundry, today announced that its second-generation 0.18um 5V/40V BCD process platform has successfully been mass produced. Featuring low on-resistance, a full high-voltage range and few photo etching layers, the platform is an ideal process choice for industrial control applications and DC-DC converters, among others.

This new platform has a 40V DMOS breakdown voltage of up to 52V, and on-resistance as low as 20 mOhm.mm2, reaching leading process levels of the node which can improve the drive capability of products, reduce the size of chips, expand the safe-operation-area (SOA) of high-voltage tubes and ensure the high reliability of products. The platform has a minimum of 18 mask layers, and offers a wide range of optional components including high-ohmic resistors, capacitors, Zener diodes, Schottky diodes, etc. This platform also offers access to an in-house designed standard cell library, SRAM compiler, IO and eFuse, providing a complete design solution for power management chips.

The Company has verified and moved into mass produced chip products in various fields including motor drive, fast charging, communication, security, DC-DC and LDO, in close cooperation with its many customers at home and abroad. With green technology, power management plays an important role. Hua Hong introduced a comprehensive power management (PMIC) BCD process solution and has a rich mass production experience at 0.5µm, 0.35µm and 0.18µm nodes. The Company will continue to leverage its expertise in BCD and eNVM processes, integrating the two to create high-end power management SOCs for intelligent power products.

“Hua Hong Semiconductor has always regarded the power management platform as a top priority of process R&D, and the mass production of the second-generation 0.18µm 5V/40V BCD process marks another improvement in our core competitiveness in the PMIC field,” Dr. Kong Weiran, Executive Vice President of Hua Hong Semiconductor remarked. “Looking ahead, we will continue to develop more advanced intelligent power management platforms to provide customers with competitive advantages in differentiated technologies.”

About Hua Hong Semiconductor

Hua Hong Semiconductor Limited (1347.HKG) is a global, leading pure-play foundry with specialty process platforms uniquely focused on eNVM, power discrete, analog & power management and logic & RF, and an outstanding quality control system that satisfies the strict requirements of automotive chip manufacturing. Hua Hong is part of the Huahong Group, a high-tech, globally oriented, highly competetive enterprise with innovative capabilities.

Hua Hong presently operates three 200mm wafer fabrication facilities within the Huahong Group (HH Fab1, HH Fab2 and HH Fab3) in Jinqiao and Zhangjiang, Shanghai, with a monthly 200mm-wafer capacity of over 170,000. A 300mm-wafer fabrication facility (HH Fab7) is being built in Wuxi’s National High-Tech Industrial Development Zone. When completed, the Wuxi fab will increase to 40,000 the Company’s monthly capacity of 300mm wafers. For more information, please visit www.huahonggrace.com.

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