Rambus Signs Patent License Agreement With Winbond

17-Jan-2017 Intellasia | BusinessWire | 4:30 AM Print This Post

Broad agreement addresses device and cloud demands for high
bandwidth, low latency, efficient memory solutions

SUNNYVALE, Calif.–(BUSINESS WIRE)–Rambus Inc. (NASDAQ:RMBS) today announced it has signed a broad
five-year patent license agreement with Winbond Electronics Corporation,
a worldwide leading supplier of specialty memory. This agreement covers
the use of Rambus patented memory solutions, including server DIMM
chipsets, for Winbond products through 2021.

“In today’s data intensive applications, computing memory solutions must
be more efficient, deliver higher levels of bandwidth and lower latency
to solutions to meet the demands of the market,” said Luc Seraphin,
general manager of the Interface Division at Rambus. “This collaborative
partnership with Winbond provides critical memory and interface
technologies that address the needs and requirements to run effective
data centers.”

Rambus develops high-performance, low-power memory and SerDes interface
chips and IP cores to meet the needs of increasingly diverse enterprise
and mobile applications. Rambus also drives innovations in
silicon-to-cloud security, making digital products safer and better.

For additional information on Rambus products and solutions, please
visit rambus.com.

Follow Rambus:

Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Rambus Inc.

Rambus creates innovative hardware and software technologies, driving
advancements from the data center to the mobile edge. Our chips,
customizable IP cores, architecture licenses, tools, software, services,
training and innovations improve the competitive advantage of our
customers. We collaborate with the industry, partnering with leading
ASIC and SoC designers, foundries, IP developers, EDA companies and
validation labs. Our products are integrated into tens of billions of
devices and systems, powering and securing diverse applications,
including Big Data, Internet of Things (IoT), mobile, consumer and media
platforms. At Rambus, we are makers of better. For more information,
visit rambus.com.

About Winbond Electronics Corp.

Winbond Electronics Corporation is a leading global supplier of
semiconductor memory solutions, headquartered in Taichung, Taiwan.
Winbond’s major products include Specialty DRAM, Mobile DRAM, and Code
Storage Flash Memory with Winbond’s memory business revenues in 2015
close to US$1 billion. Winbond has approximately 2,700 employees
worldwide, with offices in Taiwan, Hong Kong, China, Japan, Israel, and
the USA. For more information, please visit winbond.com.

Contacts

Rambus
Agnes Toan, 408-462-8905
Senior Manager, Corporate
Communications
[email protected]

 


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